SMT Assembly
Surface Mount
BYTEC has invested in surface mount technology (SMT) equipment enabling component placement down to 0402 package. Maximum efficiency is achieved by CAE programming in addition to flexible placement platforms, capable of achieving in excess of 3000 components per hour (CPH). The modular feeder system enables machine changeover time to be minimised.
The SMT placement capabilities include:
- Double and single side reflow
- down to 0402 package
- ICs
- Switches
- Connectors
BYTEC utilises camera inspection at the input to the SMT process and optical component alignment and fiducial correction through the assembly process.
Solder paste stencil hygiene is critical to ensure consistency of the application process.
Conformal Coating
Conformal coatings can protect the operational integrity of the printed circuit board assembly, especially where high reliability or exposure to harsh operating environments typical of Aerospace, Defence, Medical and Industrial applications are to be experienced.
Following component masking, boards undergo manual conformal coating.
Functional Testing
BYTEC has experience and capability in providing our customers with, cost effective, total test solutions. From in-process inspection through to customised fully functional testing, BYTEC has the skill sets to ensure the highest levels of product quality.
The in-house test department provides functional test, while external partners complement this to offer a complete test strategy.
